Record Details

High temperature tolerance in chickpea and its implications for plant improvement

OAR@ICRISAT

View Archive Info
 
 
Field Value
 
Relation http://oar.icrisat.org/6038/
http://dx.doi.org/10.1071/CP11218
 
Title High temperature tolerance in chickpea and its implications for plant improvement
 
Creator Devasirvatham, V
Tan, D K Y
Gaur, P M
Raju, T N
Trethowan, R M
 
Subject Chickpea
Agriculture-Farming, Production, Technology, Economics
 
Description Chickpea (Cicer arietinum L.) is an important food legume and heat stress affects chickpea ontogeny over a range of environments. Generally, chickpea adapts to high temperatures through an escape mechanism. However, heat stress during reproductive development can cause significant yield loss. The most important effects on the reproductive phase that affect pod set, seed set and yield are: (1) flowering time, (2) asynchrony of male and female floral organ development, and (3) impairment of male and female floral organs. While this review emphasises the importance of high temperatures >30°C, the temperature range of 32–35°C during flowering also produces distinct effects on grain yield. Recent field screening at ICRISAT have identified several heat-tolerant germplasm, which can be used in breeding programs for improving heat tolerance in chickpea. Research on the impact of heat stress in chickpea is not extensive. This review describes the status of chickpea production, the effects of high temperature on chickpea, and the opportunities for genetic improvement of chickpea tolerance to high temperatures.
 
Publisher CSIRO
 
Date 2012
 
Type Article
PeerReviewed
 
Format application/pdf
application/pdf
 
Language en
en
 
Rights

 
Identifier http://oar.icrisat.org/6038/7/DEbarshivatham_CPSC_2012Post-print.pdf
http://oar.icrisat.org/6038/1/CPS_63_419-428_2012.pdf
Devasirvatham, V and Tan, D K Y and Gaur, P M and Raju, T N and Trethowan, R M (2012) High temperature tolerance in chickpea and its implications for plant improvement. Crop and Pasture Science, 63 (5). pp. 419-428. ISSN 1836-5795