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Studies of variation of springback with curved line of bend and variable blankholder forces

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Title Studies of variation of springback with curved line of bend and variable blankholder forces
 
Creator VIJ, S
DATE, PP
 
Subject sheets
 
Description Springback, an undesirable shape change in component which occurs during unloading of component from die, becomes hard to arrest as die geometry becomes increasingly complex. In the present study, the variation of springback with curved line of bend has been examined for two U-shaped parts using finite element numerical simulations. The two geometries which have been considered are: SRail Benchmark (Numisheet '96), and C-Tray (rectangular tray with circular edges). It was noticed for both the geometries that springback is relatively higher for free ends and straight sections of line of bend than the curved portions. Subsequently, to contain the springback, higher and variable restraining (blankholder) forces were applied at areas where springback was relatively more, using split blankholders. It was observed from simulations that though variable higher restraining forces reduced the overall springback in some cases, the pattern of variation of springback along curved line of bend remained extremely similar to that with uniform blankholder forces. This indicates that the curvature of line of bend has a pronounced effect than variable blankholder forces in determining springback. The numerical analyses were performed using finite element stamping simulation software, PAM-STAMP 2G, for two materials, namely, Al-Li alloy and Standard Steel.
 
Publisher AMER INST PHYSICS
 
Date 2011-10-23T09:35:53Z
2011-12-15T09:11:05Z
2011-10-23T09:35:53Z
2011-12-15T09:11:05Z
2004
 
Type Proceedings Paper
 
Identifier MATERIALS PROCESSING AND DESIGN: MODELING, SIMULATION AND APPLICATIONS, PTS 1 AND 2,712,784-789
0-7354-0188-8
0094-243X
http://dspace.library.iitb.ac.in/xmlui/handle/10054/15090
http://hdl.handle.net/100/1838
 
Source 8th International Conference on Numerical Methods in Industrial Forming Processes,Columbus, OH,JUN 13-17, 2004
 
Language English