Electroless techniques for EMI shieldings
DSpace at IIT Bombay
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Title |
Electroless techniques for EMI shieldings
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Creator |
BHATGADDE, LG
JOSEPH, S |
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Description |
This paper discusses the progress made in the electroless plating techniques for fabrication of EMI shieldings. Although, there are alter active techniques such as zinc are spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings.
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Publisher |
SOCIETY ELECTROMAGNETIC COMPATIBILITY ENGINEERS INDIA
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Date |
2011-10-24T14:59:57Z
2011-12-15T09:11:39Z 2011-10-24T14:59:57Z 2011-12-15T09:11:39Z 1997 |
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Type |
Proceedings Paper
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Identifier |
PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY '97,443-445
81-900652-0-3 http://dx.doi.org/10.1109/ICEMIC.1997.669846 http://dspace.library.iitb.ac.in/xmlui/handle/10054/15449 http://hdl.handle.net/100/2210 |
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Source |
International Conference on Electromagnetic Interference and Compatibility 97 (INCEMIC 97),HYDERABAD, INDIA,DEC 03-05, 1997
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Language |
English
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