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Electroless techniques for EMI shieldings

DSpace at IIT Bombay

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Title Electroless techniques for EMI shieldings
 
Creator BHATGADDE, LG
JOSEPH, S
 
Description This paper discusses the progress made in the electroless plating techniques for fabrication of EMI shieldings. Although, there are alter active techniques such as zinc are spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings.
 
Publisher SOCIETY ELECTROMAGNETIC COMPATIBILITY ENGINEERS INDIA
 
Date 2011-10-24T14:59:57Z
2011-12-15T09:11:39Z
2011-10-24T14:59:57Z
2011-12-15T09:11:39Z
1997
 
Type Proceedings Paper
 
Identifier PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY '97,443-445
81-900652-0-3
http://dx.doi.org/10.1109/ICEMIC.1997.669846
http://dspace.library.iitb.ac.in/xmlui/handle/10054/15449
http://hdl.handle.net/100/2210
 
Source International Conference on Electromagnetic Interference and Compatibility 97 (INCEMIC 97),HYDERABAD, INDIA,DEC 03-05, 1997
 
Language English