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Photoplastic NEMS with an encapsulated polysilicon piezoresistor

DSpace at IIT Bombay

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Title Photoplastic NEMS with an encapsulated polysilicon piezoresistor
 
Creator KALE, NS
NAG, S
PINTO, RICHARD
RAMGOPAL RAO, V
 
Subject cantilevers
nanotechnology
piezoresistive devices
resistors
 
Description We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.
 
Publisher IEEE
 
Date 2009-01-29T12:08:08Z
2011-11-28T07:18:30Z
2011-12-15T09:56:57Z
2009-01-29T12:08:08Z
2011-11-28T07:18:30Z
2011-12-15T09:56:57Z
2008
 
Type Article
 
Identifier Proceedings of the 8th IEEE Conference on Nanotechnology, Arlington, USA, 18-21 August 2008, 460-463
978-1-4244-2103-9
10.1109/NANO.2008.140
http://hdl.handle.net/10054/586
http://dspace.library.iitb.ac.in/xmlui/handle/10054/586
 
Language en