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Stress wave attenuation in ceramic plates

DSpace at IIT Bombay

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Field Value
 
Title Stress wave attenuation in ceramic plates
 
Creator NAIK, NK
GOEL, R
KULKARNI, MD
 
Subject ultrasonic-attenuation
grain-boundaries
elastic-modulus
armor
size
 
Description Studies on planar longitudinal stress wave attenuation in thin ceramic plates are presented using a wave tracking algorithm. The results are also experimentally validated. Ceramic plates consist of grains and grain boundaries. Elastic modulus and density of the grain boundaries are less than those of the grains. When the planar longitudinal stress wave encounters an interface between the grain and the grain boundary, reflection and transmission of the incident stress wave take place because of the impedance mismatch at the interface. It is observed that this leads to attenuation in stress wave intensity. This behavior is represented by stress wave attenuation coefficient. It is observed that the stress wave attenuation coefficient is a material property. (C) 2008
 
Publisher AMER INST PHYSICS
 
Date 2011-07-16T15:57:31Z
2011-12-26T12:49:51Z
2011-12-27T05:35:36Z
2011-07-16T15:57:31Z
2011-12-26T12:49:51Z
2011-12-27T05:35:36Z
2008
 
Type Article
 
Identifier JOURNAL OF APPLIED PHYSICS, 103(10), -
0021-8979
http://dx.doi.org/10.1063/1.2921971
http://dspace.library.iitb.ac.in/xmlui/handle/10054/4466
http://hdl.handle.net/10054/4466
 
Language en