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Thermal, Mechanical, and Dielectric Properties of High Performance PEEK/AIN Nanocomposites

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Title Thermal, Mechanical, and Dielectric Properties of High Performance PEEK/AIN Nanocomposites
 
Creator GOYAL, RK
TIWARI, AN
MULIK, UP
NEGI, YS
 
Subject aluminum nitride
ether ketone)
composites
conductivity
behavior
poly(etheretherketone)
polybenzoxazine
nanoparticles
particles
expansion
nanocomposites
thermal expansion
glass transition temperature
dielectric properties
peek
 
Description The mechanical, thermal, and dielectric properties of novel high performance poly(ether-ether-ketone) (PEEK)/AIN nanocomposites were discussed. The stiffness of the nanocomposites was significantly improved in the glassy state as well as rubbery state. The coefficient of thermal expansion (CTE) of the nanocomposites was found substantially lower than that of pure PEEK. The glass transition temperature and melting temperature of the nanocomposites were increased significantly. The thermal stability and dielectric constant of the nanocomposites were increased slightly with AIN content. The significant improvement in the properties of the nanocomposites was attributed to the good adhesion between the AIN nanoparticles and the polymer matrix. The fabricated nanocomposite is very promising for use in electronics packaging substrate as an alternative substrate owing to its good thermal, mechanical and dielectric properties.
 
Publisher AMER SCIENTIFIC PUBLISHERS
 
Date 2011-07-17T04:08:14Z
2011-12-26T12:50:06Z
2011-12-27T05:36:05Z
2011-07-17T04:08:14Z
2011-12-26T12:50:06Z
2011-12-27T05:36:05Z
2009
 
Type Article
 
Identifier JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 9(12), 6902-6909
1533-4880
http://dx.doi.org/10.1166/jnn.2009.1582
http://dspace.library.iitb.ac.in/xmlui/handle/10054/4609
http://hdl.handle.net/10054/4609
 
Language en