Record Details

Cracking in drying colloidal films

DSpace at IIT Bombay

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Field Value
 
Title Cracking in drying colloidal films
 
Creator SINGH, KB
TIRUMKUDULU, MS
 
Subject granular ceramic films
patterns
model
suspension
shrinkage
fracture
 
Description It has long been known that thick films of colloidal dispersions such as wet clays, paints, and coatings crack under drying. Although capillary stresses generated during drying have been recently identified as the cause for cracking, the existence of a maximum crack-free film thickness that depends on particle size, rigidity, and packing has not been understood. Here, we identify two distinct regimes for crack-free films based on the magnitude of compressive strain at the maximum attainable capillary pressure and show remarkable agreement of measurements with our theory. We anticipate our results to not only form the basis for design of coating formulations for the paints, coatings, and ceramics industry but also assist in the production of crack-free photonic band gap crystals.
 
Publisher AMERICAN PHYSICAL SOC
 
Date 2011-07-17T12:34:01Z
2011-12-26T12:50:18Z
2011-12-27T05:36:31Z
2011-07-17T12:34:01Z
2011-12-26T12:50:18Z
2011-12-27T05:36:31Z
2007
 
Type Article
 
Identifier PHYSICAL REVIEW LETTERS, 98(21), -
0031-9007
http://dx.doi.org/10.1103/PhysRevLett.98.218302
http://dspace.library.iitb.ac.in/xmlui/handle/10054/4730
http://hdl.handle.net/10054/4730
 
Language en