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Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications

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Title Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications
 
Creator MURALI, KP
RAJESH, S
PRAKASH, O
KULKARNI, AR
RATHEESH, R
 
Subject dielectric-constant
composites
model
polymer-matrix composites
laminates
electrical properties
 
Description Micron and nano size silica fillers are incorporated in the PTFE matrix to prepare flexible composite substrates. A proprietary process comprising of sigma mixing, extrusion, calendering followed by hot pressing (SMECH process) has been employed to obtain nearly isotropic and dimensionally stable filled PTFE substrates. Theoretical modeling has been employed to predict the effective dielectric constant of the composite system and validated the results with experimental data. The distribution of particulate filler in the PTFE matrix has been studied using scanning electron microscopy. The linear coefficient of thermal expansion and ultimate tensile strength of the composite systems with respect to filler loading have been found out. Dielectric properties of the composite substrates at X-band frequency (8.2-12.4 GHz) are measured using waveguide cavity perturbation technique. Moisture absorption of fused silica filled substrates is found out conforming to IPC-TM-650 2.6.2. (C) 2009
 
Publisher ELSEVIER SCI LTD
 
Date 2011-07-22T10:36:52Z
2011-12-26T12:52:23Z
2011-12-27T05:36:51Z
2011-07-22T10:36:52Z
2011-12-26T12:52:23Z
2011-12-27T05:36:51Z
2009
 
Type Article
 
Identifier COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 40(8), 1179-1185
1359-835X
http://dx.doi.org/10.1016/j.compositesa.2009.05.007
http://dspace.library.iitb.ac.in/xmlui/handle/10054/6198
http://hdl.handle.net/10054/6198
 
Language en