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Electrical, rheological and morphological studies in co-continuous blends of polyamide 6 and acrylonitrile-butadiene-styrene with multiwall carbon nanotubes prepared by melt blending

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Title Electrical, rheological and morphological studies in co-continuous blends of polyamide 6 and acrylonitrile-butadiene-styrene with multiwall carbon nanotubes prepared by melt blending
 
Creator BOSE, S
BHATTACHARYYA, AR
KULKARNI, AR
POTSCHKE, P
 
Subject immiscible polymer blends
epoxy-resin
conductivity
percolation
black
functionalization
nanocomposites
particles
carbon nanotubes
nanocomposites
electrical properties
rheology
injection moulding
 
Description Multiwall carbon nanotubes (MWNT) were incorporated in melt-mixed co-continuous blends of polyamide 6 (PA6) and acrylonitrile-butadiene-styrene (ABS) using a conical twin-screw microcompounder. The state of dispersion of MWNT in the blends was assessed through AC electrical conductivity measurements and melt-rheological investigations. The electrical and rheological percolation threshold in PA6/ABS blends was similar to 3-4 and similar to 1-2 wt% MWNT, respectively. A unique reactive modifier (sodium salt of 6-amino hexanoic acid, Na-AHA) was employed to facilitate 'network-like' structure of MWNT and to confine them in a specific phase. This was achieved by establishing specific interactions with the delocalized 'pi-electron' clouds of MWNT and melt-interfacial reaction during melt-mixing. The electrical percolation threshold was significantly reduced in the blends (similar to 0.25 wt%) in the presence of Na-AHA modified MWNT and even coincided with the rheological percolation threshold. Significant refinement in the co-continuous structure was also observed in the presence of Na-AHA modified MWNT. (C) 2008
 
Publisher ELSEVIER SCI LTD
 
Date 2011-07-22T02:12:31Z
2011-12-26T12:52:15Z
2011-12-27T05:39:21Z
2011-07-22T02:12:31Z
2011-12-26T12:52:15Z
2011-12-27T05:39:21Z
2009
 
Type Article
 
Identifier COMPOSITES SCIENCE AND TECHNOLOGY, 69(3-4), 365-372
0266-3538
http://dx.doi.org/10.1016/j.compscitech.2008.10.024
http://dspace.library.iitb.ac.in/xmlui/handle/10054/6070
http://hdl.handle.net/10054/6070
 
Language en