Record Details

Structural characterization of electrodeposited nanophase Ni-Cu alloys

DSpace at IIT Bombay

View Archive Info
 
 
Field Value
 
Title Structural characterization of electrodeposited nanophase Ni-Cu alloys
 
Creator GHOSH, SK
GROVER, AK
DEY, GK
KULKARNI, UD
DUSANE, RO
SURI, AK
BANERJEE, S
 
Subject copper-nickel-alloys
nanocrystalline materials
pulse electrolysis
thermal-stability
phase
superlattices
growth
 
Description An investigation of Ni-Cu alloys electrodeposited from aqueous bath, using both direct current (dc) and pulsed current (pc) deposition techniques, has revealed many interesting features: A modulated structure with typical layer thickness of 90 and 75 nm of copper-rich and nickel-rich layers, respectively, is formed in dc plating. A surprising observation was that the modulation direction was parallel to the substrate, unlike in the case of artificial multilayers wherein it is along the growth direction. No such compositional modulations were observed in pc-plating in the present work. Spinodal phase separation, accompanied by L1(0) ordering, was found to have occurred in the as deposited samples in both the cases. The size of the deposited crystals in both the cases has been found to be in the range of 2.5-30 nm. Detailed high-resolution transmission electron microscopy has shown that the atomic arrangements are nearly perfect right upto the boundaries of the nanosized grains.
 
Publisher MATERIALS RESEARCH SOCIETY
 
Date 2011-08-18T16:25:12Z
2011-12-26T12:55:49Z
2011-12-27T05:42:45Z
2011-08-18T16:25:12Z
2011-12-26T12:55:49Z
2011-12-27T05:42:45Z
2006
 
Type Article
 
Identifier JOURNAL OF MATERIALS RESEARCH, 21(1), 45-61
0884-2914
http://dx.doi.org/10.1557/jmr.2006.0034
http://dspace.library.iitb.ac.in/xmlui/handle/10054/10066
http://hdl.handle.net/10054/10066
 
Language en