Record Details

A review of electroless plating techniques for electronics

DSpace at IIT Bombay

View Archive Info
 
 
Field Value
 
Title A review of electroless plating techniques for electronics
 
Creator BHATGADDE, LG
 
Subject printed-circuit boards
copper deposition
metal-deposition
fabrication
baths
 
Description This paper presents a survey on advances in electroless plating of copper, nickel, gold and palladium for fabrication of PWBs, semiconductors, EMI shieldings, computer memories and other components. Although considerable progress has been achieved in understanding the reduction mechanisms, upgrading the bath stability and enhancing the quality of electroless coatings. these processes suffer from an economic disadvantage owing to high cost of chemicals and low bath turn-overs. Besides, the number of reducing agents available for a given metallic/alloy coating has still remained at the 1960s' level. In the present context, many of them are environmentally incompatible. These and other issues involved in Large scale implementation of these techniques are discussed in the paper.
 
Publisher METAL FINISHERS ASSOC INDIA
 
Date 2011-08-18T17:34:02Z
2011-12-26T12:55:51Z
2011-12-27T05:42:55Z
2011-08-18T17:34:02Z
2011-12-26T12:55:51Z
2011-12-27T05:42:55Z
1997
 
Type Article
 
Identifier TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 6(3), 229-233
0971-5304
http://dspace.library.iitb.ac.in/xmlui/handle/10054/10085
http://hdl.handle.net/10054/10085
 
Language en