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An ecofriendly electroless copper plating process

DSpace at IIT Bombay

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Title An ecofriendly electroless copper plating process
 
Creator BHATGADDE, LG
JOSEPH, S
 
Description The conventional electroless copper plating process poses environmental problems owing to toxicity and the resultant health hazards of formaldehyde. An alternative process employing sodium hypophosphite as a reducing agent and Ni++ ions as a mediator was reported in 1980s. However, there are no reports on commercial application of this process. Thereafter in 1990, a direct metallization system (DMS), which replaces electroless copper thereby eliminating the use of formaldehyde, was developed for PCB industry. This process also has limited uses. An attempt has been made to deposit electroless copper from a bath containing sodium hypophosphite and cobalt ions as a mediator. The properties of copper coatings obtained from this bath are compared with those of formaldehyde-reduced bath for electronic applications.
 
Publisher METAL FINISHERS ASSOC INDIA
 
Date 2011-08-18T17:39:40Z
2011-12-26T12:55:51Z
2011-12-27T05:42:56Z
2011-08-18T17:39:40Z
2011-12-26T12:55:51Z
2011-12-27T05:42:56Z
1996
 
Type Article
 
Identifier TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 5(4), 55-60
0971-5304
http://dspace.library.iitb.ac.in/xmlui/handle/10054/10087
http://hdl.handle.net/10054/10087
 
Language en