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Low temperature coefficient of resistivity Ag-Cd and Ag-Sn alloys - structure and transport

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Title Low temperature coefficient of resistivity Ag-Cd and Ag-Sn alloys - structure and transport
 
Creator HORO, J
HARNE, PG
NAYAK, BB
VITTA, S
 
Subject thin-film resistors
ag-alloys
temperature co-efficient of resistivity
 
Description The microstructure vis-a-vis electrical transport behavior of Ag-Cd and Ag-Sn binary alloys in the temperature range 70-300 K has been studied. The 22.2 wt.% Cd and 29.4 wt.% Cd alloys were both found to have a single-phase structure made of solid solution of Ag. The lattice parameter however increased with increasing Cd content in the alloy. The microstructure of 17.7 wt.% Sn and 23.5 wt.% Sn alloys however is made of two phases Ag4Sn and Ag3Sn. The resistivity of Ag-Cd alloys increased with increasing Cd content and the temperature coefficient of resistivity (TCR) decreased to 1560 ppm K-1 for the 29.4 wt.% Cd alloy compared to 4100 ppm K-1 for pure Ag. The lowest TCR however was obtained for the 17.7 wt.% Sn alloy, 375 ppm K-1, which has a room temperature resistivity of 23.93 RQ cm. (C) 2003
 
Publisher ELSEVIER SCIENCE SA
 
Date 2011-07-28T11:21:40Z
2011-12-26T12:59:12Z
2011-12-27T05:50:13Z
2011-07-28T11:21:40Z
2011-12-26T12:59:12Z
2011-12-27T05:50:13Z
2004
 
Type Article
 
Identifier MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 107(1), 53-57
0921-5107
http://dx.doi.org/10.1016/j.mseb.2003.10.012
http://dspace.library.iitb.ac.in/xmlui/handle/10054/7388
http://hdl.handle.net/10054/7388
 
Language en