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Selective electroless plating-a new technique for GaAs MMICs

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Title Selective electroless plating-a new technique for GaAs MMICs
 
Creator MAHAPATRA, S
CHOUDHURY, D
BHATGADDE, LG
 
Subject iii-v semiconductors
mmic
electroless deposition
gallium arsenide
integrated circuit manufacture
metallisation
strip lines
waveguides
 
Description A simple, cost-effective processing technique, selective electroless plating, is proposed for GaAs monolithic microwave integrated circuits (MMICs). Microwave measurements show that the attenuation properties of transmission lines fabricated by this processing technique are comparable to the attenuation properties of lines fabricated by the traditional evaporation lift-off technique.
 
Publisher IEEE
 
Date 2008-11-24T05:39:54Z
2011-11-25T16:01:15Z
2011-12-26T13:05:19Z
2011-12-27T05:51:44Z
2008-11-24T05:39:54Z
2011-11-25T16:01:15Z
2011-12-26T13:05:19Z
2011-12-27T05:51:44Z
1991
 
Type Article
 
Identifier IEEE Transactions on Semiconductor Manufacturing 4(1), 69-72
0894-6507
http://dx.doi.org/10.1109/66.75856
http://hdl.handle.net/10054/129
http://dspace.library.iitb.ac.in/xmlui/handle/10054/129
 
Language en_US