Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging
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Title |
Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging
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Creator |
GOYAL, RK
JADHAV, P TIWARI, AN |
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Subject |
THERMAL-CONDUCTIVITY
MELT INTERCALATION NANOCOMPOSITES PARTICLES BEHAVIOR EXPANSION FRICTION TIO2 WEAR Composites glass transition dielectric properties microhardness thermal expansion |
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Description |
The thermal, mechanical, and dielectric properties of new high-performance polyphenylene sulfide/aluminum nitride (AlN) composites prepared by hot pressing were investigated for use in electronic packaging. The coefficient of thermal expansion was decreased by 41%. The glass-transition temperature and Vickers microhardness were increased by 13A degrees C and 46%, respectively, for the 15.1 vol.% AlN composite. A modified rule of mixtures with beta of 0.065 fits the data. The dielectric constant and loss factor of the composites are within the range of requirements for commercial use.
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Publisher |
SPRINGER
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Date |
2012-06-26T06:01:04Z
2012-06-26T06:01:04Z 2011 |
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Type |
Article
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Identifier |
JOURNAL OF ELECTRONIC MATERIALS,40(6)1377-1383
0361-5235 http://dx.doi.org/10.1007/s11664-011-1520-5 http://dspace.library.iitb.ac.in/jspui/handle/100/13993 |
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Language |
English
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