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Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging

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Title Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging
 
Creator GOYAL, RK
JADHAV, P
TIWARI, AN
 
Subject THERMAL-CONDUCTIVITY
MELT INTERCALATION
NANOCOMPOSITES
PARTICLES
BEHAVIOR
EXPANSION
FRICTION
TIO2
WEAR
Composites
glass transition
dielectric properties
microhardness
thermal expansion
 
Description The thermal, mechanical, and dielectric properties of new high-performance polyphenylene sulfide/aluminum nitride (AlN) composites prepared by hot pressing were investigated for use in electronic packaging. The coefficient of thermal expansion was decreased by 41%. The glass-transition temperature and Vickers microhardness were increased by 13A degrees C and 46%, respectively, for the 15.1 vol.% AlN composite. A modified rule of mixtures with beta of 0.065 fits the data. The dielectric constant and loss factor of the composites are within the range of requirements for commercial use.
 
Publisher SPRINGER
 
Date 2012-06-26T06:01:04Z
2012-06-26T06:01:04Z
2011
 
Type Article
 
Identifier JOURNAL OF ELECTRONIC MATERIALS,40(6)1377-1383
0361-5235
http://dx.doi.org/10.1007/s11664-011-1520-5
http://dspace.library.iitb.ac.in/jspui/handle/100/13993
 
Language English