Record Details

High performance polymer/AlN composites for electronic substrate application

DSpace at IIT Bombay

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Field Value
 
Title High performance polymer/AlN composites for electronic substrate application
 
Creator GOYAL, RK
TIWARI, AN
NEGI, YS
 
Subject Polymer-matrix composites
Electrical properties
Thermal properties
Powder processing
 
Description An ideal high performance poly(etheretherketone) (PEEK)/AlN composite that has unique combination of anisotropic linear coefficient of thermal expansion (CTE) and dielectric properties was developed for the use in electronic packaging substrate as an alternative of conventionally used epoxy/E-glass substrate. The out-of-plane and in-plane CTEs of the composites were very close to that of copper and silicon chip, respectively. The dielectric constants of the composites are almost independent with increasing frequency. The dissipation factor decreased approximately 50% compared to the pure PEEK. These results reveal that the composite may be the futuristic candidate for high performance electronic packaging substrate. (c) 2012 Elsevier Ltd. All rights reserved.
 
Publisher ELSEVIER SCI LTD
 
Date 2014-10-16T13:22:57Z
2014-10-16T13:22:57Z
2013
 
Type Article
 
Identifier COMPOSITES PART B-ENGINEERING, 4770-74
http://dx.doi.org/10.1016/j.compositesb.2012.10.025
http://dspace.library.iitb.ac.in/jspui/handle/100/15655
 
Language en