Effect of substrate on electroplated copper sulphide thin films
DSpace at IIT Bombay
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Title |
Effect of substrate on electroplated copper sulphide thin films
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Creator |
BHARATHI, B
THANIKAIKARASAN, S KOLLU, P CHANDRASEKAR, PV SANKARANARAYANAN, K SHAJAN, XS |
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Subject |
DEPOSITION
GROWTH |
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Description |
Copper Sulphide thin films have been prepared on different substrates using electrodeposition technique. X-ray diffraction analysis showed that the prepared films possess polycrystalline in nature with cubic structure. Microstructural parameters such as crystallite size, strain and dislocation density are determined using X-ray diffraction data. Film composition and surface morphology have been analyzed using Scanning electron microscopy and Energy dispersive analysis by X-rays. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.2 and 2.4 eV for films obtained on different substrates.
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Publisher |
SPRINGER
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Date |
2014-12-28T14:37:51Z
2014-12-28T14:37:51Z 2014 |
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Type |
Article
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Identifier |
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 25(12)5338-5344
0957-4522 1573-482X http://dx.doi.org/10.1007/s10854-014-2310-7 http://dspace.library.iitb.ac.in/jspui/handle/100/16772 |
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Language |
English
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