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Effect of substrate on electroplated copper sulphide thin films

DSpace at IIT Bombay

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Field Value
 
Title Effect of substrate on electroplated copper sulphide thin films
 
Creator BHARATHI, B
THANIKAIKARASAN, S
KOLLU, P
CHANDRASEKAR, PV
SANKARANARAYANAN, K
SHAJAN, XS
 
Subject DEPOSITION
GROWTH
 
Description Copper Sulphide thin films have been prepared on different substrates using electrodeposition technique. X-ray diffraction analysis showed that the prepared films possess polycrystalline in nature with cubic structure. Microstructural parameters such as crystallite size, strain and dislocation density are determined using X-ray diffraction data. Film composition and surface morphology have been analyzed using Scanning electron microscopy and Energy dispersive analysis by X-rays. Optical absorption analysis showed that the prepared films possess band gap value in the range between 2.2 and 2.4 eV for films obtained on different substrates.
 
Publisher SPRINGER
 
Date 2014-12-28T14:37:51Z
2014-12-28T14:37:51Z
2014
 
Type Article
 
Identifier JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 25(12)5338-5344
0957-4522
1573-482X
http://dx.doi.org/10.1007/s10854-014-2310-7
http://dspace.library.iitb.ac.in/jspui/handle/100/16772
 
Language English