Part I: High-Voltage MOS Device Design for Improved Static and RF Performance
DSpace at IIT Bombay
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Title |
Part I: High-Voltage MOS Device Design for Improved Static and RF Performance
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Creator |
GUPTA, A
SHRIVASTAVA, M BAGHINI, MS SHARMA, DK GOSSNER, H RAO, VR |
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Subject |
LDMOS
IMPACT TRANSISTORS TECHNOLOGY Advanced CMOS drain-extended MOS (DeMOS) high-power RF integrated RF power amplifier (PA) system-on-chip (SoC) |
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Description |
In this paper, for the first time, the key design parameters of a shallow trench isolation-based drain-extended MOS transistor are discussed for RF power applications in advanced CMOS technologies. The tradeoff between various dc and RF figures of merit (FoMs) is carefully studied using well-calibrated TCAD simulations. This detailed physical insight is used to optimize the dc and RF behavior, and our work also provides a design window for the improvement of dc as well as RF FoMs, without affecting the breakdown voltage. An improvement of 50% in R-ON and 45% in RF gain is achieved at 1 GHz. Large-signal time-domain analysis is done to explore the output power capability of the device.
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Publisher |
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
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Date |
2016-01-15T09:11:07Z
2016-01-15T09:11:07Z 2015 |
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Type |
Article
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Identifier |
IEEE TRANSACTIONS ON ELECTRON DEVICES, 62(10)3168-3175
0018-9383 1557-9646 http://dx.doi.org/10.1109/TED.2015.2470117 http://dspace.library.iitb.ac.in/jspui/handle/100/18242 |
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Language |
en
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