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Wafer bonding — A powerful tool for MEMS

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Title Wafer bonding — A powerful tool for MEMS
 
Creator Bhat, K N
Gupta, A Das
Rao, P R S
Gupta, N Das
Bhattacharya, E
Sivakumar, K
Kumar, V Vinoth
Anitha, L Helen
Joseph, J D
Madhavi, S P
Natarajan, K
 
Subject Silicon fusion bonding
Silicon on insulator
Piezoresitive pressure sensor
MOSFET amplifier integration with sensor
 
Description 311-316
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS based sensors and actuators. Various silicon wafer bonding techniques and their role on MEMS devices such as pressure sensors, accelerometers and micropump have been discussed. The results on the piezoresistive pressure sensors monolithically integrated with a MOSFET differential amplifier circuit have been presented to demonstrate the important role played by the Silicon Fusion Bonding technique for integration of sensors with electronics on a single chip.
 
Date 2008-10-31T10:24:47Z
2008-10-31T10:24:47Z
2007-04
 
Type Article
 
Identifier 0019-5596
http://hdl.handle.net/123456789/2327
 
Language en_US
 
Relation B81B7/02
 
Publisher CSIR
 
Source IJPAP Vol.45(4) [April 2007]