Record Details

Variation of surface layer during chemical mechanical polish

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Field Value
 
Title Variation of surface layer during chemical mechanical polish
 
Creator Jianbin, Luo
 
Subject Tribology
Two phases flow
Wear
Chemical mechanical polish
 
Description 403-405
Nanoparticles have been widely used in oils and polish slurry such as chemical mechanical polish (CMP) process. The movement of nanoparticles in liquid and the interaction between nano-particles and solid surface are very important to obtain an atomic smooth surface in CMP process. This paper presents both experimental and theoretical studies on the movement of nanoparticles in fluid and the collision between nanoparticles as well as that between the particles and solid surfaces in two phases flowing process.
 
Date 2008-10-31T10:19:12Z
2008-10-31T10:19:12Z
2007-04
 
Type Article
 
Identifier 0019-5596
http://hdl.handle.net/123456789/2320
 
Language en_US
 
Relation B82B
 
Publisher CSIR
 
Source IJPAP Vol.45(4) [April 2007]