Variation of surface layer during chemical mechanical polish
NOPR - NISCAIR Online Periodicals Repository
View Archive InfoField | Value | |
Title |
Variation of surface layer during chemical mechanical polish
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Creator |
Jianbin, Luo
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Subject |
Tribology
Two phases flow Wear Chemical mechanical polish |
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Description |
403-405
Nanoparticles have been widely used in oils and polish slurry such as chemical mechanical polish (CMP) process. The movement of nanoparticles in liquid and the interaction between nano-particles and solid surface are very important to obtain an atomic smooth surface in CMP process. This paper presents both experimental and theoretical studies on the movement of nanoparticles in fluid and the collision between nanoparticles as well as that between the particles and solid surfaces in two phases flowing process. |
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Date |
2008-10-31T10:19:12Z
2008-10-31T10:19:12Z 2007-04 |
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Type |
Article
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Identifier |
0019-5596
http://hdl.handle.net/123456789/2320 |
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Language |
en_US
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Relation |
B82B
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Publisher |
CSIR
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Source |
IJPAP Vol.45(4) [April 2007]
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