Extracellular Polysaccharides of a Copper-Sensitive and a Copper-Resistant Pseudomonas Aeruginosa Strain: Synthesis, Chemical Nature and Copper Binding
EPrints@IICB
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Title |
Extracellular Polysaccharides of a Copper-Sensitive and a Copper-Resistant Pseudomonas Aeruginosa Strain: Synthesis, Chemical Nature and Copper Binding |
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Creator |
Kazy, Sufia K
Sar, Pinaki Singh, S P Sen, Asish K D’Souza, S F |
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Subject |
Chemistry
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Description |
Extracellular polysaccharides (EPS) of a copper-sensitive (Cus) and a copper-resistant (Cur) Pseudomonas aeruginosa strain were investigated in terms of their production, chemical nature and response towards copper exposure. The extent of EPS synthesis by the resistant strain (4.78 mg mg)1 cell dry wt.) was considerably higher over its sensitive counterpart (2.78 mg mg)1 dry wt.). FTIR-spectroscopy and gas chromatography revealed that both the polymers were acidic in nature, containing alginate as the major component along with various neutraland amino-sugars. Acid content in the Cur EPS (480.54 mg g)1) was greater than that in the Cus EPS (442.0mg g)1). Presence of Cu2þ in the growth medium caused a dramatic stimulation (approximately 4-fold) in EPS synthesis by the Cur strain, while in a similar condition, the Cus failed to exhibit such response. The polymer of the resistant strain showed elevated Cu2þ binding (320mg g)1 EPS) compared to that of the sensitive type (270mg g)1). The overall observations show the potential of the Cur EPS for its deployment in metal bioremediation. |
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Publisher |
Kluwer
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Date |
2002
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Type |
Article
PeerReviewed |
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Format |
application/pdf
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Identifier |
http://www.eprints.iicb.res.in/791/1/WORLD_JOURNAL_OF_MICROBIOLOGY_%26_BIOTECHNOLOGY__18(_6)_583%2D588;2002[38].pdf
Kazy, Sufia K and Sar, Pinaki and Singh, S P and Sen, Asish K and D’Souza, S F (2002) Extracellular Polysaccharides of a Copper-Sensitive and a Copper-Resistant Pseudomonas Aeruginosa Strain: Synthesis, Chemical Nature and Copper Binding. World Journal of Microbiology and Biotechnology, 18 (6). pp. 583-588. |
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Relation |
http://dx.doi.org/10.1023/A:1016354713289
http://www.eprints.iicb.res.in/791/ |
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