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Investigation on electroless copper metallization on FDM built ABS parts

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Title Investigation on electroless copper metallization on FDM built ABS parts
 
Creator Mohapatra, Bijay Kumar
Sahu, Anshuman Kumar
Siba Sankar Mahapatra, Anshuman Kumar
 
Subject Acrylonitrile-butadiene-styrene (ABS)
Copper metallization
Fused deposition modelling (FDM)
 
Description 174-181
In this work, metallization of copper on acrylonitrile-butadiene-styrene (ABS) substrate has been fabricated by fused
deposition modelling (FDM) using electroless process avoiding chemicals detrimental to environment. Four acidic baths
containing five weight percentages of HF, H2SO4, HNO3 and H3PO4 varying copper sulphate (CuSO4) at 10, 15 and
20 weight percentage in each bath has been used for metallization. The metallization process in each bath has continued for
seventy two hours. Copper coating obtained on the substrate by the use of different baths has been evaluated for electrical
resistance, thickness of copper coated layer, percentage of copper present on the coated surface and adhesion performance.
Scanning electron microscopy (SEM) and energy dispersion X-ray spectroscopy (EDX) results have indicated that all the
baths are quite capable of deposition of copper on ABS substrates. However, HF bath has exhibited superior coating
performance as compared to other baths. The thickness of copper coated layer and percentage of copper present in the
coated layer has been found to be highest by the use of HF bath with fifteen weight percentage of CuSO4.
 
Date 2021-07-07T06:20:52Z
2021-07-07T06:20:52Z
2021-04
 
Type Article
 
Identifier 0975-1017 (Online); 0971-4588 (Print)
http://nopr.niscair.res.in/handle/123456789/57654
 
Language en
 
Publisher CSIR-NIScPR, India
 
Source IJEMS Vol.28(2) [April 2021]