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Investigation on electroless copper metallization on FDM built ABS parts<br />

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Title Statement Investigation on electroless copper metallization on FDM built ABS parts<br />
 
Added Entry - Uncontrolled Name Mohapatra, Bijay Kumar; Department of Mechanical Engineering, National Institute of Technology Rourkela, Rourkela, Odisha 769 008, India
Sahu, Anshuman Kumar; Department of Mechanical Engineering, National Institute of Technology Rourkela, Rourkela, Odisha 769 008, India
Mahapatra, Siba Sankar; Department of Mechanical Engineering, National Institute of Technology Rourkela, Rourkela, Odisha 769 008, India
 
Uncontrolled Index Term Mechanical Engineering
Acrylonitrile-butadiene-styrene (ABS), Fused deposition modelling (FDM), Copper metallization
 
Summary, etc. <p class="Abstract"><span lang="EN-GB">In this work, metallization of copper on acrylonitrile-butadiene-styrene (ABS) substrate has been fabricated by fused deposition modelling (FDM) using electroless process avoiding chemicals detrimental to environment. Four acidic baths containing five weight percentages of HF, H<sub>2</sub>SO<sub>4</sub>, HNO<sub>3</sub> and H<sub>3</sub>PO<sub>4</sub> varying copper sulphate (CuSO<sub>4</sub>) at 10, 15 and 20 weight percentage in each bath has been used for metallization. The metallization process in each bath has continued for seventy two hours. Copper coating obtained on the substrate by the use of different baths has been evaluated for electrical resistance, thickness of copper coated layer, percentage of copper present on the coated surface and adhesion performance. Scanning electron microscopy (SEM) and energy dispersion X-ray spectroscopy (EDX) results have indicated that all the baths are quite capable of deposition of copper on ABS substrates. However, HF bath has exhibited superior coating performance as compared to other baths. The thickness of copper coated layer and percentage of copper present in the coated layer has been found to be highest by the use of HF bath with fifteen weight percentage of CuSO<sub>4</sub>.</span></p>
 
Publication, Distribution, Etc. Indian Journal of Engineering and Materials Sciences (IJEMS)
2021-07-20 11:15:34
 
Electronic Location and Access application/pdf
http://op.niscair.res.in/index.php/IJEMS/article/view/40106
 
Data Source Entry Indian Journal of Engineering and Materials Sciences (IJEMS); ##issue.vol## 28, ##issue.no## 2 (2021): IJEMS- April-2021
 
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Nonspecific Relationship Entry http://op.niscair.res.in/index.php/IJEMS/article/download/40106/465524596
http://op.niscair.res.in/index.php/IJEMS/article/download/40106/465524597
http://op.niscair.res.in/index.php/IJEMS/article/download/40106/465524598
 
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