Patents Commercialization Profile of Universities and Higher Education Institutes in India
NOPR - NISCAIR Online Periodicals Repository
View Archive InfoField | Value | |
Title |
Patents Commercialization Profile of Universities and Higher Education Institutes in India
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Creator |
Bhardwaj, Mamta
Sandhu, Amandeep Ghumman, Navkiran |
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Subject |
Commercialization
Higher Education Institutes Form-27 Indian Patent Office Working Patents Science Technology and Innovation Policy 2020 Translational Research Ecosystem |
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Description |
199-207
Innovation is the key ingredient that drives the economic growth of the nation. Globalization has diminished barriers thereby, delivering a larger market area for these innovations. Countries like USA, China, South Korea, Japan, etc. have acknowledged this fact and are thriving through consistent innovation. They have a dynamic ecosystem that supports and encourages commercialization worthy research and development (R&D) through healthy engagements among the various stakeholders. Higher Education Institutes (HEIs), a vital component of this ecosystem, offer themselves as a cradle of fundamental research and a powerhouse of potential innovations. Countries like USA have banked heavily on their HEIs, such as, Stanford and Harvard, building a sustainable framework around them. Indian HEIs, which have long been in the practice of publication of their technological advancements, are also making the transition towards the patenting system. Although the IP movement at most HEIs in India is still in nascent stages, roots have already been formed at a few select institutes.This paper attempts to provide an overview of Indian HEIs leading in patents granted and their commercialisation status, based on the “Statements of Working filed” on Form-27 at the Indian Patent Office (IPO). |
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Date |
2021-11-01T10:14:22Z
2021-11-01T10:14:22Z 2021-07 |
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Type |
Article
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Identifier |
0975-1076 (Online); 0971-7544 (Print)
http://nopr.niscair.res.in/handle/123456789/58375 |
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Language |
en
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Publisher |
NIScPR-CSIR, India
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Source |
JIPR Vol.26(4) [July 2021]
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