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Ultrasonic transducer tuning using wafer bonding method

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Title Ultrasonic transducer tuning using wafer bonding method
 
Creator Harun, J W
Yaacob, M I H
 
Subject Piezoelectric
Piezoelectric micromachined ultrasonic transducer
Sonar
Ultrasonic
Underwater
Wafer bonding
 
Description 954-959
This study demonstrates the wafer bonding method for performance tuning of piezoelectric Micromachined Ultrasonic
Transducer (pMUT) from on-the-shelf piezoelectric disc (PZT). Polydimethylsiloxane (PDMS) and Epoxy were studied as
adhesive materials. A thick bonding layer was deposited using the spin coating technique. Wafer bonding was carried out at
room temperature to simulate in-situ pMUT repairing scenario. Bonding integrity is analyzed using Field Emission Scanning
Electron Microscope (FESEM) images, while electrical characterization of pMUT is carried out using impedance analysis.
Fabricated pMUTs have been calibrated using the pulse-echo technique in a freshwater tank. This study found that PDMS at the
minimum thickness of 28 μm is preferably compatible for in-situ wafer bonding of pMUT compared to the Epoxy. PDMS has
significantly reduced device impedance at 62.4 % reduction compared to 58.9 % reduction for Epoxy. Both pMUTs were able
to transmit and receive short acoustic ping with the calibrated speed of sound of 1333.3 m/s. PDMS has successfully contributed
to a broader operating frequency between 30 – 150 kHz for transmission and 75 – 140 kHz for the reception.
 
Date 2022-03-14T09:59:49Z
2022-03-14T09:59:49Z
2021-11
 
Type Article
 
Identifier 2582-6727 (Online); 2582-6506 (Print)
http://nopr.niscair.res.in/handle/123456789/59322
 
Language en
 
Publisher NIScPR-CSIR, India
 
Source IJMS Vol.50(11) [November 2021]