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Effect of clay minerals on copper reclamation from leached solution

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Title Effect of clay minerals on copper reclamation from leached solution
 
Creator Palanisamy, Murugesan Manikkampatti
Myneni, Venkata Ratnam
Palaniyappan, Akilamudhan
 
Subject Aqua regia
Bentonite Clay
EDXs
E-waste
Leached solution
Response surface methodolog
 
Description 157-165
The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying
simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using
aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as
an adsorbent. The optimum condition of process variables is found through central composite design-response surface
methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of
adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This
investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues.
 
Date 2022-05-17T10:35:38Z
2022-05-17T10:35:38Z
2022-03
 
Type Article
 
Identifier 0975-0991 (Online); 0971-457X (Print)
http://nopr.niscair.res.in/handle/123456789/59731
 
Language en
 
Publisher CSIR-NIScPR, India
 
Source IJCT Vol.29(2) [March 2022]