Effect of clay minerals on copper reclamation from leached solution
NOPR - NISCAIR Online Periodicals Repository
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Title |
Effect of clay minerals on copper reclamation from leached solution
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Creator |
Palanisamy, Murugesan Manikkampatti
Myneni, Venkata Ratnam Palaniyappan, Akilamudhan |
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Subject |
Aqua regia
Bentonite Clay EDXs E-waste Leached solution Response surface methodolog |
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Description |
157-165
The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as an adsorbent. The optimum condition of process variables is found through central composite design-response surface methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues. |
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Date |
2022-05-17T10:35:38Z
2022-05-17T10:35:38Z 2022-03 |
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Type |
Article
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Identifier |
0975-0991 (Online); 0971-457X (Print)
http://nopr.niscair.res.in/handle/123456789/59731 |
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Language |
en
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Publisher |
CSIR-NIScPR, India
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Source |
IJCT Vol.29(2) [March 2022]
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