Record Details

<strong>Effect of clay minerals on copper reclamation from leached solution</strong>

Online Publishing @ NISCAIR

View Archive Info
 
 
Field Value
 
Authentication Code dc
 
Title Statement <strong>Effect of clay minerals on copper reclamation from leached solution</strong>
 
Added Entry - Uncontrolled Name Murugesan, Manikkampatti Palanisamy; Anna University Chennai
 
Uncontrolled Index Term Aqua regia; Bentonite Clay; EDXs; E-waste; Leached solution; Response surface methodolog
 
Summary, etc. <p style="text-align: justify;"><span>The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as an adsorbent. The optimum condition of process variables is found through central composite design-response surface methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues.</span></p>
 
Publication, Distribution, Etc. Indian Journal of Chemical Technology (IJCT)
2022-07-12 11:59:22
 
Electronic Location and Access application/pdf
http://op.niscair.res.in/index.php/IJCT/article/view/51345
 
Data Source Entry Indian Journal of Chemical Technology (IJCT); ##issue.vol## 29, ##issue.no## 2 (2022): Indian Journal of Chemical Technology
 
Language Note en