Investigation of active surface area of tool electrode and peak current on discharge energy during ECDM process<br />
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Title Statement |
Investigation of active surface area of tool electrode and peak current on discharge energy during ECDM process<br /> |
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Added Entry - Uncontrolled Name |
Rathore, Ranjeet Singh; Engineering College Bikaner Dvivedi, Akshay ; IIT Roorkee |
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Uncontrolled Index Term |
Mechanical Engineering Active surface area, Depth Of Penetration (DOP), Hole Over Cut (HOC), Material Removal Rate (MRR), Peak current |
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Summary, etc. |
<p>The Electrochemical Discharge Machining (ECDM) process is a hybrid non-conventional machining process. It is usedfor machinings hard and brittle materials such as borosilicate glass and ceramic materials. In the ECDM process, activesurface area ( dipped tool ) and peak current affect the discharge energy, which further influences the quality of the microholes. The present article is aimed to investigate the effect of active surface area and peak current on the performancecharacteristics during the ECDM process. Experiments were conducted to investigate the affect of active surface area andpeak currenton Depth Of Penetration (DOP), the Hole Over Cut (HOC), and Material Removal Rate (MRR) based on thereaction rate during ECDM of borosilicate glass. The experimental results reveal that both the MRR and HOC increase inincreasing the peak current and decreasing the active surface area. The maximum DOP and MRR were obtained at 5A peakcurrent with 2 mm tool immersion depth and 7A peak current with 1 mm tool immersion depth, respectively. The minimumHOC was obtained at 2A peak current with a 3 mm tool immersion depth.</p> |
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Publication, Distribution, Etc. |
Indian Journal of Engineering and Materials Sciences (IJEMS) 2022-08-25 03:20:50 |
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Electronic Location and Access |
application/pdf http://op.niscair.res.in/index.php/IJEMS/article/view/46225 |
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Data Source Entry |
Indian Journal of Engineering and Materials Sciences (IJEMS); ##issue.vol## 29, ##issue.no## 4 (2022): IJEMS-AUGUST 2022 |
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Language Note |
en |
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Terms Governing Use and Reproduction Note |
Except where otherwise noted, the Articles on this site are licensed under Creative Commons License: CC Attribution-Noncommercial-No Derivative Works 2.5 India © 2015. The Council of Scientific & Industrial Research, New Delhi. |
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