Synthesis, structural characterization and Hirshfeld surface analysis of copper(I) complexes containing hemilabile-ferrocenylbisphosphine [Fe{C5H4P(C6H4CH2NMe2-o)2}2]
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Title |
Synthesis, structural characterization and Hirshfeld surface analysis of copper(I) complexes containing hemilabile-ferrocenylbisphosphine [Fe{C5H4P(C6H4CH2NMe2-o)2}2]
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Creator |
Mondal, Dipanjan
Rao, Sowmya Mague, Joel T Balakrishna, Maravanji S |
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Subject |
Ferrocenylbisphosphine
Copper complexes Crystal structure Hirshfeld surface analysis Dangling amines |
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Description |
1081-1090
The reactions of ferrocenylbisphosphine, [Fe{C5H4P(C6H4CH2NMe2-o)2}2] (1) comprising dangling amine functionalities with CuX yielded dinuclear complexes [{Cu2(μ-X)2}{Fe(C5H4P(C6H4CH2NMe2-o)2)2}] (2, X = Cl; 3, X = Br; 4 X = I). The reaction of 4 with pyridine affords a binuclear complex, [{Cu2I2(py)2}{Fe(C5H4P(C6H4CH2NMe2-o)2)2}] (5) (py = pyridine) in which each copper atom is tetracoordinated. Similarly, treatment of 4 with 2,2'-bipyridine in 1:1 molar ratio afforded the binuclear complex, [{Cu2I2(2,2′-bipy)}{Fe-(C5H4P(C6H4CH2NMe2-o)2)2}] (6). The equimolar reaction of 3 and 4,4'-bipyridine affords [{Cu2Br2(4,4′-bipy)}2{Fe(C5H4P- (C6H4CH2NMe2-o)2)2}2] (7) in good yield. The complexes 2 and 4 have been structurally characterized; both crystallize in the monoclinic space group with C2/c. In the crystal packing of 2 and 4, the invention-related intermolecular C-HX (X = Cl and I) and C-H(ring) interactions are primarily responsible for the crystal packing. A Hirshfeld surface analysis indicates that the most significant contributions to the crystal packing of 2 are from HH (81.7%), CH/HC (12.4%), ClH/HCl (4.3%) contacts, while those for 4 are from HH (80.9%), CH/HC (12.1%), IH/HI (5.4%) contacts. |
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Date |
2023-10-17T10:50:28Z
2023-10-17T10:50:28Z 2023-10 |
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Type |
Article
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Identifier |
2583-1321 (Online); 0019-5103 (Print)
http://nopr.niscpr.res.in/handle/123456789/62775 https://doi.org/10.56042/ijc.v62i10.6188 |
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Language |
en
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Publisher |
NIScPR-CSIR, India
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Source |
IJC Vol.62(10) [October 2023]
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