ICAR Research Data Repository for Knowledge Management
Phase Field Modeling of Ghost Diffusion in Sn-Ag-Cu Solder Joints
Harvard Dataverse (Africa Rice Center, Bioversity International, CCAFS, CIAT, IFPRI, IRRI and WorldFish)
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| Title |
Phase Field Modeling of Ghost Diffusion in Sn-Ag-Cu Solder Joints
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| Identifier |
https://doi.org/10.7910/DVN/AOIVPK
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| Creator |
Naveen Weerasekera
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| Publisher |
Harvard Dataverse
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| Description |
In this paper, we have introduced a phase field modeling technique to simulate ghost diffusion phenomena of intermetallic compounds in a bulk metallic matrix phase. We used Zenner-Frank phase field approach to define free energy density functional which is to be evolved using Chan-Hilliard and Alan-Chan equations to simulate time evolution of the precipitates. We verified our simulation results with intermetallic compound growth of Sn-Ag-Cu solder joints in isothermal aging process attributing to the diffusion of Ag3Sn intermetallic compound. Herewith we present that Zenner-Frank model demonstrates sound validity and provides a best understanding of such phenomena. |
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| Subject |
Chemistry
Engineering Physics phase field modeling isothermal aging Zenner-Frank phase field kinetics multiscale modeling |
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| Contributor |
Weerasekera, Naveen D
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