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New water soluble nickel(II) and copper(II) oxime complexes containing acid group: DNA interaction investigations

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Title New water soluble nickel(II) and copper(II) oxime complexes containing acid group: DNA interaction investigations
 
Creator Biltekin, Murat
Topkaya, Cansu Gökçe
Güp, Ramazan
 
Subject Water soluble metal complexes
Oximes
DNA interactions
 
Description 293-303
This study explores the DNA-binding and DNA-cleaving properties of two newly synthesized oxime derivative ligands
and their complexes with Cu(II) and Ni(II) metal ions. Sodium salts of these compounds have been prepared to ensure water
solubility. The structures of the ligands and complexes have been elucidated through various analytical techniques,
including 1H NMR, FT-IR, TGA, UV-Vis, SEM-EDS, and XRD analyses. The results reveal that these compounds interact
with DNA without significantly altering its structure. They primarily bind to DNA grooves, particularly major grooves. The
study has determined that the optimal concentration for these interactions is 75 μM. Viscometry studies show that these
compounds do not substantially change DNA viscosity, suggesting groove binding as their mode of interaction without
major structural modifications to DNA. Gel electrophoresis, an effective tool for elucidating DNA cleavage mechanisms,
indicates that DNA cleavage activity persists in the presence of radical scavengers, although it is reduced, especially in
compounds known to bind to DNA grooves. In broader terms, complexes with Ni(II) exhibit higher DNA interaction
activity than Cu(II) for both ligands. Among the ligands themselves, H2L1 demonstrates higher activity than H3L2. In
conclusion, this research reveals that these compounds interact with DNA, primarily through groove binding, with minimal
impact on DNA structure. This has implications for biomedical and pharmaceutical applications, highlighting these
compounds’ potential in these fields.
 
Date 2024-03-19T11:08:16Z
2024-03-19T11:08:16Z
2024-03
 
Type Article
 
Identifier 2583-1321 (Online); 0019-5103 (Print)
http://nopr.niscpr.res.in/handle/123456789/63591
https://doi.org/10.56042/ijc.v63i3.6687
 
Language en
 
Publisher NIScPR-CSIR,India
 
Source IJC Vol.63(03) [March 2024]