DSpace at IIT Bombay
- » Ranking based uncertainty quantification for a multifidelity design approach
- » Design and analysis of a spherical mobile robot
- » On the number of generators of Cohen-Macaulay ideals
- » New interference approach for ballistic impact into stacked flexible composite body armor
- » An approximation algorithm for finding long paths in Hamiltonian graphs
- » Averaging Q(parallel to X parallel to) for a complex circularly Gaussian random vector X : a novel approach
- » Distributed filter processes
- » A lower bound for the shortest path problem
- » Statistical properties of curved polymer
- » A polymerization-depolymerization model for generation of contractile force during bacterial cell division
- » A compositional axiomatization of statecharts
- » Chromic transitions in polydiacetylenes: Poly(1-(3-quinolyl)-4-((CH2)(N)OCONHCH2OCO(CH2)(3)CH3)-buta-1,3-diyne)
- » Tensile bond strength of an adhesive resin cement to different alloys having various surface treatments
- » Analytical study of natural convection in a cavity with volumetric heat generation
- » Prediction of organizational-effectiveness as a function of type of organizational-structure
- » Variation on physico-mechanical properties of Kota stone under different watery environments
- » Photoluminescence studies on RF plasma-polymerized thin films
- » Radiation-assisted interactions between gold and copper across a Nickel barrier
- » Enhanced nonlinear optical responses in metal-glass nanocomposites
- » Faraday effect in cubic and tetragonal copper ferrite CuFe2O4 films - comparative studies
- » Synthesis of beaded and entwined carbon nanofibers in Ni : Al alloy catalyst
- » Coal utilization in India - mobilization of selected elements to the surface environment
- » A novel approach to increase emission wavelength of InAs/GaAs quantum dots by using a quaternary capping layer
- » Comparison of single-layer and bilayer InAs/GaAs quantum dots with a higher InAs coverage
- » 622 Mb/s/channel parallel digital optical receiver array module using hybrid packaging